Equipment by Keywords
Click on keyword to expand or minimize the panels below. To reserve equipment time, or to view more information about an equipment, click on the equipment name. Visit the Equipment Rates page for our equipment rate schedule.
Display by:
Show:
- +3D Printing
- -Dicing/Bonding
- +Electron Microscopy/Microanalysis
- +Film Deposition
- +Hot Processing
- +Metrology
- +Other Analytical Techniques
- +Particle Analysis/Characterization
- +Photolithography
- +Plasma
- +Porosimetry/Porometry/Surface Area
- +Powder Mechanics
- +Sample Preparation
- +Spectroscopy
- +Surface Analysis/Characterization
- +Wet Processing
- +X-Ray Analysis/Characterization
- +Other (No Associated Keywords)
| Dicing Saws- ADT | Status: Available |
| K&S 4124 Ball Bonder, Gold Ball | Status: Available |
| K&S 4700 Wedge Bonder (Staff Run) | Status: Available |
| Wafer Bonder, EVG 501 | Status: Available |