DRIE - Oxford Plasma Pro - Status: Available
General Information
- Current Status:
- Available
- Use Rates:
- External Academic & Government:
- $76.50/Hour
- External Affiliated Commercial/Industrial:
- $76.50/Hour
- External Commercial/Industrial:
- $102.00/Hour
- External International Academic:
- $102.00/Hour
- Internal Standard:
- $51.00/Hour
- Service:
- Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
- Building:
- NANO (0070)
- In Cleanroom:
- Yes
- Main Contact:
- David Hays
Description
One hour prior notice is required for the operation of this machine
The Oxford Plasma Pro 100 is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high
aspect ratio features in silicon only. The process provides high selectivity for etching Si with most
common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE
CHAMBER.
Capabilities
One hour prior notice is required for the operation of this machine
The Oxford Plasma Pro 100 is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high
aspect ratio features in silicon only. The process provides high selectivity for etching Si with most
common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE MOT ALLOWED IN THE
CHAMBER.
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