FIB/SEM - FEI Helios NanoLab 600i dual beam - Status: Available
General Information
- Current Status:
- Available
- Use Rates:
- External Academic & Government:
- $103.50/Hour
- External Affiliated Commercial/Industrial:
- $199.30/Hour
- External Commercial/Industrial:
- $265.70/Hour
- External International Academic:
- $138.00/Hour
- Internal Standard:
- $69.00/Hour
- Service:
- Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
- Building:
- NRB (0557)
- Room:
- Room (8E)
- In Cleanroom:
- No
- Main Contact:
- Nicholas Rudawski
Description
The FEI Helios NanoLab 600i DualBeam system integrates focused ion and scanning electron beams for FIB and SEM functionality in one instrument.
Instrument Specifications:
YouTube video demonstrating what is covered in basic training of the Helios
YouTube video tutorial on use of the Helios to prepare lamellas
Zoom workshop on dual FIB/SEM tips, tricks, and other useful info (recorded 11/19/21)
EDAX webinar: introduction to EBSD
TRAINING REQUIREMENTS:
1. Please create an NRF user account with a PI-approved funding source.
2. Please complete NRF general safety training.
3. Please complete the FIB/SEM Prerequisite Training course through eLearning; submit a training request using the "Training" link at the bottom of the page and follow the instructions to be added to the course; you must complete this course regardless of any prior coursework or operational experience related to SEM or FIB you may have.
4. Users working on radioactive materials must also complete the Radiation Safety Source Course (2.0).
5. Users working on radioactive materials must also obtain a personal dosimeter badge.
Capabilities
- High-quality S/TEM lamella preparation via in-situ lift-out method
- High-quality cross-section face preparation
- High-resolution (<1 nm) top-down and cross-sectional SEM imaging
- Nanoscale (<100 nm) to microscale (>1 um) electron and ion beam-assisted milling, patterning, and deposition
- Automated serial sectioning and cross-section face imaging
- Nanoscale (<100 nm) to microscale (>1 um)compositional analysis using EDS
- Nanoscale (<100 nm) to microscale (>1 um) texture and crystallographic analysis using EBSD
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