RIE/ICP - Unaxis SLR - Status: Available
General Information
- Current Status:
- Available
- Use Rates:
- External Academic & Government:
- $76.50/Hour
- External Affiliated Commercial/Industrial:
- $76.50/Hour
- External Commercial/Industrial:
- $102.00/Hour
- External International Academic:
- $102.00/Hour
- Internal Standard:
- $51.00/Hour
- Service:
- Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
- Building:
- NANO (0070)
- In Cleanroom:
- Yes
- Main Contact:
- Bill Lewis
Description
Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials. Features: -Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2 -Wafer Clamping and He backside cooling- For 4” wafers only. Pieces smaller than 75mm may be processed without backside cooling. -Temperature controlled chamber -2KW ICP, 600W RIE -Automatic wafer load via load lock
Capabilities
Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials. Features: -Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2 -Wafer Clamping and He backside cooling. 4” and 5” wafer capable. 3” and 6” capable with purchase of additional wafer clamps. -Temperature controlled chamber -2KW ICP, 600W RIE -Automatic wafer load via load lock
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