Wafer Bonder, EVG 501 - Status: Available

• General Information
• Prerequisites
• Calendar
• Training
• Contacts
• Documents

General Information

Current Status:

Available

Use Rates:

External Academic & Government:

$51.00/Hour

External Affiliated Commercial/Industrial:

$51.00/Hour

External Commercial/Industrial:

$68.00/Hour

External International Academic:

$68.00/Hour

Internal Standard:

$34.00/Hour

Service:

Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.

Building:

NANO (0070)

Room:

Cleanroom, Hot Processing (166)

In Cleanroom:

Yes

Main Contact:

Stuart Ding

Capabilities

Available only for thermal compression bonding up to 500C for 4" wafers. Precise alignment of wafer samples requires the use of the EVG620 aligner.