FIB/SEM - FEI Helios G4 PFIB CXe dual beam - Status: Available
General Information
- Current Status:
- Available
- Use Rates:
- External Academic & Government:
- $103.50/Hour
- External Affiliated Commercial/Industrial:
- $199.30/Hour
- External Commercial/Industrial:
- $265.70/Hour
- External International Academic:
- $138.00/Hour
- Internal Standard:
- $69.00/Hour
- Service:
- Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
- Building:
- NANO (0070)
- Room:
- Dual-Beam Fib (132)
- In Cleanroom:
- No
- Main Contact:
- Nicholas Rudawski
Description
*ANALYSIS OF RADIOACTIVE SPECIMENS WITH THIS INSTRUMENT IS STRICTLY PROHIBITED*
PLEASE NOTE: published rates are for the first 8 hours of usage; the rates then decrease as specified below (runs not to exceed 24 hours in total):
- Internal standard - $17.25/h
- External academic and government - $25.90/h
- External international academic - $34.50/h
- External affiliated commercial/industrial - $51.75/h
- External commercial/industrial - $69/h
- Elstar UC+ SEM column; 0.3 - 30 kV operating voltage with <1 nm resolution
- Field-free (high-resolution) and immersion (ultrahigh-resolution) SEM modes
- Schottky field emission gun electron source
- Plasma FIB 2.0 column; 2 - 30 kV operating voltage; 1 pA - 2.5 uA beam currents
- Xe plasma ion source
- Everhart-Thornley and through lens detectors; configurable for SE+BSE or BSE only imaging
- In-situ Pt deposition GIS
- In-situ W deposition GIS
- EasyLift in-situ micromanipulator
- EDAX Octane Elite (70 mm squared active area) SDD energy dispersive spectroscopy system
- EDAX Velocity CMOS EBSD camera
- EDAX APEX EDS and EBSD acquisition and analysis software
- EDAX OIM 8 texture and crystallographic analysis software
- Auto Slice and View serial sectioning software
- Ga-free S/TEM lamella preparation via in-situ lift-out method
- Rapid, large scale (>100 um) cross-section face preparation
- High-resolution (<1 nm) top-down and cross-sectional SEM imaging
- Nanoscale (<100 nm) to microscale (>1 um) electron and ion beam-assisted milling, patterning, and deposition
- Automated serial sectioning and cross-section face imaging
- Nanoscale (<100 nm) to microscale (>1 um) compositional analysis using EDS
- Nanoscale (<100 nm) to microscale (>1 um) texture and crystallographic analysis using EBSD
The FEI Helios G4 PFIB CXe DualBeam system integrates focused ion and scanning electron beams for FIB and SEM functionality in one instrument.
Instrument Specifications:
Virtual workshop: dual FIB/SEM tips, tricks, and other useful info (11/19/21)
YouTube tutorial: EBSD using EDAX Velocity EBSD camera and TEAM software (08/24/22)
YouTube tutorial: dual PFIB/SEM for S/TEM lamella preparation (03/03/23)
EDAX webinar: introduction to EBSD (10/03/23)
EDAX webinar: post-processing of EBSD data (02/02/22)
EDAX webinar: optimizing EBSD results using OIM 8 (02/22/22)
YouTube tutorial: dual PFIB/SEM for in-situ UHR SEM imaging of PFIB-prepared cross-sections (04/13/24)
YouTube tutorial: dual PFIB/SEM for S/TEM lamella preparation (02/11/25)
YouTube tutorial: EBSD + EDS using EDAX Velocity EBSD, Octane Elite EDS, and APEX software (02/24/25)
TRAINING REQUIREMENTS:
1. Please create an NRF user account with a PI-approved funding source.
2. Please complete NRF general safety training.
3. Please complete the FIB/SEM Prerequisite Training course through eLearning; submit a training request using the "Training" link at the bottom of the page and follow the instructions to be added to the course; you must complete this course regardless of any prior coursework or operational experience related to SEM or FIB you may have.
Capabilities
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