Litho Process Karl Suss MA6 - Status: Down
  • Current Status: Down
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $68.25/Hour
    • External Affiliated Commercial/Industrial: $68.25/Hour
    • External Commercial/Industrial: $91.00/Hour
    • External International Academic: $91.00/Hour
    • Internal Standard: $45.50/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Cleanroom, Photolithography (165)
  • In Cleanroom: Yes
  • Main Contact: Bill Lewis
 Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in four modes; hard contact, soft contact, vacuum and proximity. It can accommodate exposure of irregularly shaped substrates and standard wafers to 6”. Features: Contact 1:1 aligner. DUV and IR capability Approximate Exposure Intensity: 8 mW/cm2@365 nm, 5 mW/cm2@405 nm Constant exposure intensity controller Two mask holder sizes are available, 4" and 5". Wafer size is 4" and pieces. Maximum wafer thickness 4.3mm Split field microscope for top-side viewing/alignment. resolution = down to .8um in vacuum contact mode @ 400nm

The use of the developer station (not tracked/charged) is built into the charge rate.

Photolithography wiki link
Photoresist wiki link
Microfabrication wiki link
Capabilities Training Prerequisites Calendar Contacts Docs
Title
Equipment ImageDownload
Liftoff - S1813 Image ReversalDownload
Litho Process, Karl Suss MA6 SOPDownload
NRF Lithography Processes SOPDownload

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