Litho Process Karl Suss MA6 - Status: Down
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Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in four modes; hard contact, soft contact, vacuum and proximity. It can accommodate exposure of irregularly shaped substrates and standard wafers to 6”.
Features:
Contact 1:1 aligner.
DUV and IR capability
Approximate Exposure Intensity: 8 mW/cm2@365 nm, 5 mW/cm2@405 nm
Constant exposure intensity controller
Two mask holder sizes are available, 4" and 5".
Wafer size is 4" and pieces.
Maximum wafer thickness 4.3mm
Split field microscope for top-side viewing/alignment.
resolution = down to .8um in vacuum contact mode @ 400nm
The use of the developer station (not tracked/charged) is built into the charge rate. Photolithography wiki link Photoresist wiki link Microfabrication wiki link |
Use Prerequisites
| Prerequisite | Description | Status |
|---|---|---|
| Computer Access | Requires computer access be setup | Check Your Status |
| Funding Source | Requires permission to an active funding source | Check Your Status |
| Work Plan | Requires a work plan be approved by PI and staff | Check Your Status |
| Agreement Form | Requires completed agreement form for equipment usage | Check Your Status |
| NRF Safety Training | Requires completion of safety training | Check Your Status |
| NRF Building Access | Requires issue of an id badge and entry badge and/or access level to be set. | Check Your Status |
| Equipment Training | Requires completion of equipment training | Check Your Status |
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