Litho Process Karl Suss MA6 - Status: Available
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Description: The Karl Suss MA-6 Contact Aligner system can perform precision mask-to-wafer (sample) 1:1 contact printing in four modes; hard contact, soft contact, vacuum and proximity. It can accommodate exposure of irregularly shaped substrates and standard wafers to 6”.
Features:
Contact 1:1 aligner.
DUV and IR capability
Approximate Exposure Intensity: 8 mW/cm2@365 nm, 5 mW/cm2@405 nm
Constant exposure intensity controller
Two mask holder sizes are available, 4" and 5".
Wafer size is 4" and pieces.
Maximum wafer thickness 4.3mm
Split field microscope for top-side viewing/alignment.
resolution = down to .8um in vacuum contact mode @ 400nm
The use of the developer station (not tracked/charged) is built into the charge rate. Photolithography wiki link Photoresist wiki link Microfabrication wiki link |
| Training Topic | Description | Rates | Approx Session Length (hrs) |
|---|---|---|---|
| Mask Aligner Karl Suss MA6 Training | Standard Rate: $46.00/Complete User Training | 2 |
| Start | End | Availability | Location | |
|---|---|---|---|---|
| Fri, Apr. 11, 2025 1:30 PM | Fri, Apr. 11, 2025 3:30 PM | 1 Seats out of 1 | NRF | Sign Up |
| Mon, Apr. 21, 2025 9:00 AM | Mon, Apr. 21, 2025 11:00 AM | 1 Seats out of 1 | NRF | Sign Up |
| Mon, May. 5, 2025 9:00 AM | Mon, May. 5, 2025 11:00 AM | 1 Seats out of 1 | NRF | Sign Up |
| Fri, May. 9, 2025 1:30 PM | Fri, May. 9, 2025 3:30 PM | 1 Seats out of 1 | NRF | Sign Up |
| Mon, May. 19, 2025 9:00 AM | Mon, May. 19, 2025 11:00 AM | 1 Seats out of 1 | NRF | Sign Up |
To request a training session at a custom date & time, please click an option below.
Request and Sign Up for Priority Mask Aligner Karl Suss MA6 Training
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