RIE - Unaxis 790 RIE - Status: In Use
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Description: Unaxis 790 Reactive Ion Etcher. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, dielectrics and other commonly used materials.
Features:
-Process Gases Available: CHF3, CF4, O2, He.
-Substrates up to 8" diameter
-Temperature controlled chamber
-500W RIE
-Manual wafer load.
Reactive-Ion Etching wiki link Plasma Etching wiki link Microfabrication wiki link |
Use Prerequisites
Prerequisite | Description | Status |
---|---|---|
Computer Access | Requires computer access be setup | Check Your Status |
Funding Source | Requires permission to an active funding source | Check Your Status |
Work Plan | Requires a work plan be approved by PI and staff | Check Your Status |
Agreement Form | Requires completed agreement form for equipment usage | Check Your Status |
NRF Safety Training | Requires completion of safety training | Check Your Status |
NRF Building Access | Requires issue of an id badge and entry badge and/or access level to be set. | Check Your Status |
Equipment Training | Requires completion of equipment training | Check Your Status |
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