RIE - Unaxis 790 RIE - Status: Available
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Description: Unaxis 790 Reactive Ion Etcher. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, dielectrics and other commonly used materials.
Features:
-Process Gases Available: CHF3, CF4, O2, He.
-Substrates up to 8" diameter
-Temperature controlled chamber
-500W RIE
-Manual wafer load.
Reactive-Ion Etching wiki link Plasma Etching wiki link Microfabrication wiki link |
Description: Unaxis 790 Reactive Ion Etcher. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, dielectrics and other commonly used materials.
Features:
-Process Gases Available: CHF3, CF4, O2, He.
-Substrates up to 8" diameter
-Temperature controlled chamber
-500W RIE
-Manual wafer load.
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