RIE/ICP - Unaxis SLR - Status: Available
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Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials. Features: -Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2 -Wafer Clamping and He backside cooling- For 4” wafers only. Pieces smaller than 75mm may be processed without backside cooling. -Temperature controlled chamber -2KW ICP, 600W RIE -Automatic wafer load via load lock |
| Training Topic | Description | Rates | Approx Session Length (hrs) |
|---|---|---|---|
| RIE/ICP Unaxis SLR Training | Standard Rate: $30.00/Complete User Training | 1 |
| Start | End | Availability | Location | Options |
|---|---|---|---|---|
| Wed, Apr. 1, 2026 1:30 PM | Wed, Apr. 1, 2026 2:30 PM | 1 Seats out of 1 | NRF | Sign Up |
| Tue, Apr. 14, 2026 9:00 AM | Tue, Apr. 14, 2026 10:00 AM | 1 Seats out of 1 | NRF | Sign Up |
| Wed, Apr. 29, 2026 1:30 PM | Wed, Apr. 29, 2026 2:30 PM | 1 Seats out of 1 | NRF | Sign Up |
| Tue, May. 12, 2026 9:00 AM | Tue, May. 12, 2026 10:00 AM | 1 Seats out of 1 | NRF | Sign Up |
To request a training session at a custom date & time, please click an option below.
Request and Sign Up for Priority RIE/ICP Unaxis SLR Training
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