RIE/ICP - Unaxis SLR - Status: Available
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Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials.
Features:
-Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2
-Wafer Clamping and He backside cooling- For 4” wafers only. Pieces smaller than 75mm may be processed without backside cooling.
-Temperature controlled chamber
-2KW ICP, 600W RIE
-Automatic wafer load via load lock
Reactive-Ion Etching wiki link Plasma Etching wiki link Microfabrication wiki link |
Training Topic | Description | Rates | Approx Session Length (hrs) |
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RIE/ICP Unaxis SLR Training | Standard Rate: $30.00/Complete User Training | 1 |
Start | End | Availability | Location | |
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Wed, Oct. 16, 2024 1:30 PM | Wed, Oct. 16, 2024 2:30 PM | 1 Seats out of 1 | NRF | Sign Up |
Tue, Oct. 29, 2024 9:00 AM | Tue, Oct. 29, 2024 10:00 AM | 1 Seats out of 1 | NRF | Sign Up |
Wed, Nov. 13, 2024 1:30 PM | Wed, Nov. 13, 2024 2:30 PM | 1 Seats out of 1 | NRF | Sign Up |
Tue, Nov. 26, 2024 9:00 AM | Tue, Nov. 26, 2024 10:00 AM | 1 Seats out of 1 | NRF | Sign Up |
To request a training session at a custom date & time, please click an option below.
Request and Sign Up for Priority RIE/ICP Unaxis SLR Training
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