RIE/ICP - Unaxis SLR - Status: In Use
  • Current Status: In Use
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $74.25/Hour
    • External Affiliated Commercial/Industrial: $74.25/Hour
    • External Commercial/Industrial: $99.00/Hour
    • External International Academic: $99.00/Hour
    • Internal Standard: $49.50/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Cleanroom, Dry Etch (162)
  • In Cleanroom: Yes
  • Main Contact: Bill Lewis
 Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials. Features: -Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2 -Wafer Clamping and He backside cooling- For 4” wafers only. Pieces smaller than 75mm may be processed without backside cooling. -Temperature controlled chamber -2KW ICP, 600W RIE -Automatic wafer load via load lock

Reactive-Ion Etching wiki link
Plasma Etching wiki link
Microfabrication wiki link
Capabilities Training Prerequisites Calendar Contacts Docs

Use Prerequisites

PrerequisiteDescriptionStatus
Computer AccessRequires computer access be setupCheck Your Status
Funding SourceRequires permission to an active funding sourceCheck Your Status
Work PlanRequires a work plan be approved by PI and staffCheck Your Status
Agreement FormRequires completed agreement form for equipment usageCheck Your Status
NRF Safety TrainingRequires completion of safety trainingCheck Your Status
NRF Building AccessRequires issue of an id badge and entry badge and/or access level to be set.Check Your Status
Equipment TrainingRequires completion of equipment trainingCheck Your Status

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