RIE/ICP - Unaxis SLR - Status: In Use
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Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials.
Features:
-Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2
-Wafer Clamping and He backside cooling- For 4” wafers only. Pieces smaller than 75mm may be processed without backside cooling.
-Temperature controlled chamber
-2KW ICP, 600W RIE
-Automatic wafer load via load lock
Reactive-Ion Etching wiki link Plasma Etching wiki link Microfabrication wiki link |
Contact Level | Name | |
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1 | Lewis, Bill | walewis@ufl.edu |
2 | Hays, David | dhays@nimet.ufl.edu |
General Contact: nrfinfo@mail.ufl.edu
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