RIE/ICP - Unaxis SLR - Status: Available

Current Status: Available
Training: View Topics/Sessions
Use Rates:
- External Academic & Government: $76.50/Hour
- External Affiliated Commercial/Industrial: $76.50/Hour
- External Commercial/Industrial: $102.00/Hour
- External International Academic: $102.00/Hour
- Internal Standard: $51.00/Hour
Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
Building: NANO (0070)
Room: Cleanroom, Dry Etch (162)
In Cleanroom: Yes
Main Contact: Bill Lewis

Description: Unaxis Shuttlelock Reactive Ion Etcher with Inductively Coupled Plasma Module. Etch Capabilities: SiO2, Si3N4, photoresist, polyimide, Al, dielectrics and other commonly used materials. Features: -Process Gases Available: SF6, CL2, CHF3, O2, Ar, H2, CH4, N2 -Wafer Clamping and He backside cooling- For 4” wafers only. Pieces smaller than 75mm may be processed without backside cooling. -Temperature controlled chamber -2KW ICP, 600W RIE -Automatic wafer load via load lock

Capabilities Training Prerequisites Calendar Contacts Docs

Title
Equipment Image	Download
RIE/ICP, Unaxis SLR SOP	Download

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