DRIE - Deep RIE, STS - Status: Available
  • Current Status: Available
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $74.25/Hour
    • External Affiliated Commercial/Industrial: $74.25/Hour
    • External Commercial/Industrial: $99.00/Hour
    • External International Academic: $99.00/Hour
    • Internal Standard: $49.50/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Cleanroom, Dry Etch (162)
  • In Cleanroom: Yes
  • Main Contact: David Hays
 One hour prior notice is required for the operation of this machine

The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only.  The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER.

Bosch Process wiki link
Plasma Etching wiki link
Microfabrication wiki link
Capabilities Training Prerequisites Calendar Contacts Docs

Use Prerequisites

PrerequisiteDescriptionStatus
Computer AccessRequires computer access be setupCheck Your Status
Funding SourceRequires permission to an active funding sourceCheck Your Status
Work PlanRequires a work plan be approved by PI and staffCheck Your Status
Agreement FormRequires completed agreement form for equipment usageCheck Your Status
NRF Safety TrainingRequires completion of safety trainingCheck Your Status
NRF Building AccessRequires issue of an id badge and entry badge and/or access level to be set.Check Your Status
Equipment TrainingRequires completion of equipment trainingCheck Your Status

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