DRIE - Deep RIE, STS - Status: Down
  • Current Status: Down
  • Training: View Topics/Sessions
  • Use Rates:
    • External Academic & Government: $74.25/Hour
    • External Affiliated Commercial/Industrial: $74.25/Hour
    • External Commercial/Industrial: $99.00/Hour
    • External International Academic: $99.00/Hour
    • Internal Standard: $49.50/Hour
  • Service: Request Service Quote. The Staff rate is $50/hour (Internal) and $55 /hour (External) in addition to the instrument rate.
  • Building: NANO (0070)
  • Room: Cleanroom, Dry Etch (162)
  • In Cleanroom: Yes
  • Main Contact: David Hays
 One hour prior notice is required for the operation of this machine

The STS DRIE is an Inductively Coupled Plasma Process etcher designed and configured to etch deep high aspect ratio features in silicon only.  The process provides high selectivity for etching Si with most common Photoresist and SiO2 masks. EXPOSED METALS AND METAL MASKS ARE NOT ALLOWED IN THE CHAMBER.

Bosch Process wiki link
Plasma Etching wiki link
Microfabrication wiki link
Capabilities Training Prerequisites Calendar Contacts Docs

To select the time for your reservation, click on the calendar at the desired start time and drag to the desired end time. If you are logged in, the reservations will display the names of the reservation users. Note: If the calendar is down, the following link may also be used to create a reservation: Create Reservation (Quick Form)

Calendar ICS Path

An active Gatorlink login is required to create a new reservation.