Flexus 2320 - Status: Available
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The Flexus 2320 determines wafer curvature by measuring the angle of deflection of a laser beam off the surface 6”, 4”, 3” and 2” diameter substrates. Film stress is determined by comparing the change in radius of curvature of the substrate, with and without the film.
Radius of curvature wiki link |
Use Prerequisites
Prerequisite | Description | Status |
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Computer Access | Requires computer access be setup | Check Your Status |
Funding Source | Requires permission to an active funding source | Check Your Status |
Work Plan | Requires a work plan be approved by PI and staff | Check Your Status |
Agreement Form | Requires completed agreement form for equipment usage | Check Your Status |
NRF Safety Training | Requires completion of safety training | Check Your Status |
UF myTraining Course Completion | Requires completion of myTraining courses. | Check Your Status |
NRF Building Access | Requires issue of an id badge and entry badge and/or access level to be set. | Check Your Status |
Equipment Training | Requires completion of equipment training | Check Your Status |
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