RIE/ICP - Trion - Status: Available
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The Trion etcher is load lock equipped and operated via a touch screen interface. The user may employ either RIE (Reactive Ion Etching) RF power applied at the sample stage or ICP (Inductively Coupled Plasma) RF power applied at the shower head above the sample stage. The system is configured to use both chlorinated and fluorinated gases to perform a wide variety of etch recipes. The following gasses are available for use on the Trion etcher: O2, CHF3, CF4, Ar, BCl3, Cl2, and SF6.
Reactive-Ion Etching wiki link Plasma Etching wiki link Microfabrication wiki link |
Use Prerequisites
Prerequisite | Description | Status |
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Computer Access | Requires computer access be setup | Check Your Status |
Funding Source | Requires permission to an active funding source | Check Your Status |
Work Plan | Requires a work plan be approved by PI and staff | Check Your Status |
Agreement Form | Requires completed agreement form for equipment usage | Check Your Status |
NRF Safety Training | Requires completion of safety training | Check Your Status |
NRF Building Access | Requires issue of an id badge and entry badge and/or access level to be set. | Check Your Status |
Equipment Training | Requires completion of equipment training | Check Your Status |
An active Gatorlink login is required to create a new reservation.